A Study of Crack Propagation in Pb-Free Solder JointsCAERS, J. F. J. M; ZHAO, X. J; LAI, Yi-Shao et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 2, pp 84-90, issn 1521-334X, 7 p.Article

Formation and Growth of Intermetallic Compounds in Cu-Au and Au-Al Systems for Copper on Gold BondingYINGWEI JIANG; RONGLU SUN; YOUMIN YU et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 228-235, issn 1521-334X, 8 p.Article

High Lateral Resolution Auger Electron Spectroscopic (AES) Measurements for Sn Whiskers on Brass : Tin whiskersBOZACK, Michael J; CRANDALL, Erika R; RODEKOHR, Chad L et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 198-204, issn 1521-334X, 7 p.Article

Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation : Tin whiskersJADHAV, Nitin; BUCHOVECKY, Eric J; REINBOLD, Lucine et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 183-192, issn 1521-334X, 10 p.Article

Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental ApproachAMY, R. A; AGLIETTI, G. S; RICHARDSON, G et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 4, pp 303-311, issn 1521-334X, 9 p.Article

An Empirical Comparison of Spatial Randomness Models for Yield AnalysisFELLOWS, Heyward H; MASTRANGELO, Christina M; WHITE, K. Preston et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 2, pp 115-120, issn 1521-334X, 6 p.Article

Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking AssemblyTONG HONG WANG; LAI, Yi-Shao; LEE, Chang-Chi et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 1, pp 14-21, issn 1521-334X, 8 p.Article

Geometric Analysis and Manufacturing Considerations for Optimizing the Characteristics of a Twisted PairLAGO, Alfonso; PENALVER, Carlos M; MARCOS, Jorge et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 1, pp 22-31, issn 1521-334X, 10 p.Article

Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam MillingOMID MOKHTARI AMIRMAJDI; ASHYER-SOLTANI, Roya; CLODE, Michael Paul et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 265-271, issn 1521-334X, 7 p.Article

Reliable Lead-Free Rework Process for Stacked CSP ComponentsIYER, Satyanarayan; SRIHARI, Krishnaswami.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 214-220, issn 1521-334X, 7 p.Article

3-D Measurement of Solder Paste Using Two-Step Phase Shift ProfilometryHUI, Tak-Wai; PANG, Grantham Kwok-Hung.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 306-315, issn 1521-334X, 10 p.Article

Development of Warpage Measurement System to Simulate Convective Solder Reflow ProcessPOWELL, Reinhard E; UME, I. Charles.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 83-90, issn 1521-334X, 8 p.Article

Flip Chip Assembly of Thinned Silicon Die on Flex SubstratesBANDA, Charles; JOHNSON, R. Wayne; TAN ZHANG et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 1-8, issn 1521-334X, 8 p.Article

In Situ Acoustic Température Measurement During Variable-Frequency Microwave CuringDAVIS, Cleon E; DICKHERBER, Anthony J; HUNT, William D et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 273-284, issn 1521-334X, 12 p.Article

Selecting an E-Scrap Reverse Production System Design Considering Multicriteria and UncertaintyCHEN, Wen-Chih; HONG, I-Hsuan.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 4, pp 326-332, issn 1521-334X, 7 p.Article

Wide-Bandwidth Coaxial PWB Transmission Line ProbePAULTER, N. G; PALM, R. H; BARRY, D. D et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 2, pp 150-158, issn 1521-334X, 9 p.Article

A methodology for drop performance modeling and application for design optimization of chip-scale packages : Drop testingSYED, Ahmer; SEUNG MO KIM; WEI LIN et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 1, pp 42-48, issn 1521-334X, 7 p.Article

Insights into correlation between board-level drop reliability and package-level ball impact test characteristics : Drop testingYEH, Chang-Lin; LAI, Yi-Shao.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 1, pp 84-91, issn 1521-334X, 8 p.Article

Low-force electric contact processes on Cu electrodesKATAOKA, Kenichi; ITOH, Toshihiro; OKUMURA, Katsuya et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 3, pp 194-199, issn 1521-334X, 6 p.Article

Optimizing disassembly and recycling process for EOL LCD-type products : A heuristic methodSHIH, Li-Hsing; LEE, Shun-Chung.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 3, pp 213-220, issn 1521-334X, 8 p.Article

Scheduling integrated circuit assembly operations on die bonderPEARN, W. L; CHUNG, S. H; LAI, C. M et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 2, pp 97-105, issn 1521-334X, 9 p.Article

Sn corrosion and its influence on whisker growth : Tin whiskersOSENBACH, J. W; DELUCCA, J. M; POTTEIGER, B. D et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 1, pp 23-35, issn 1521-334X, 13 p.Article

Surface resistivity characterization of new printed circuit board materials for use in spacecraft electronicsBULLETTI, Andrea; CAPINERI, Lorenzo; MATERASSI, Maurizio et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 2, pp 115-122, issn 1521-334X, 8 p.Article

Thermal cycling aging effect on the reliability and morphological evolution of SnAgCu solder jointsRONNIE TEO, J. W.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 4, pp 279-284, issn 1521-334X, 6 p.Article

Double bump flip-chip assemblyYAN, Kathy Wei; JOHNSON, R. Wayne; STAPLETON, Russell et al.IEEE transactions on electronics packaging manufacturing. 2006, Vol 29, Num 2, pp 119-133, issn 1521-334X, 15 p.Article